Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment
Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment
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DOI：
10.4071/1551-4897-6.1.66
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发表时间：
2009
影响因子：
--
通讯作者：
P. Quintero;F. McCluskey
中科院分区：
文献类型：
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作者：
P. Quintero;F. McCluskey
对于能够在高于传统125°C限制的温度下工作的电子产品的需求持续增加。基于宽带隙半导体的器件已被证明可在高达500°C的温度下工作，但封装仍然是产品开发的主要障碍。最近的法规，如RoHS和WEEE，增加了封装任务的复杂性，因为它们禁止在电子产品中使用某些材料，如传统上用于高温焊料贴片的铅(Pb)。在这项研究中，提出了一种Ag-In焊膏作为高温应用的芯片连接替代方案。采用瞬态液相烧结法对该材料进行了处理，使其主要成分实现了原位合金化。差示扫描量热仪证实了体系熔点的移动，为突破典型的加工温度规律提供了基础。机械完整性和可靠性..。
The demand for electronics capable of operating at temperatures above the traditional 125°C limit continues to increase. Devices based on wide band gap semiconductors have been demonstrated to operate at temperatures up to 500°C, but packaging remains a major hurdle to product development. Recent regulations, such as RoHS and WEEE, increase the complexity of the packaging task as they prohibit the use of certain materials in electronic products such as lead (Pb), which has traditionally been used in high temperature solder die attach. In this investigation, an Ag-In solder paste is presented as a die attach alternative for high temperature applications. The proposed material has been processed by a transient liquid phase sintering method resulting in an in situ alloying of its main constituents. A shift of the melting point of the system, confirmed by differential scanning calorimetry, provided the basis for a breakthrough in the typical processing temperature rule. The mechanical integrity and reliabilit...