Cu-Ni-Sn-P合金の応力緩和特性の解明
Cu-Ni-Sn-P合金の応力緩和特性の解明
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Cu-Ni-Sn-P 合金应力松弛特性的阐明
DOI：
10.2320/jinstmet.72.427
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发表时间：
2008
影响因子：
--
通讯作者：
亮一 門前
中科院分区：
文献类型：
--
作者：
文哉 西嶋;幸矢 野村;千尋 渡邊;亮一 門前
研究了合金元素对Cu-Ni-Sn-P系合金应力松弛性能的影响。（1.4质量%）Ni合金，Cu-0.75原子%（0.7质量%）Ni-0.75原子%（1.4质量%）Sn合金和Cu-1.5原子%将Sn添加到Cu中通过将Sn原子的气氛拖到位错后面来增强对应力松弛的抗性。Cu-Ni-P合金比Cu-Ni和Cu-P合金具有更好的应力松弛性能，这可能是因为由P和Ni化学键对产生的原子被移动的位错拖曳。在300°C的低温下短时间退火含P的Cu合金带来更高的抗应力松弛性。这是由于退火过程中P原子在位错上的偏聚使移动的位错密度降低。在Cu-Ni-Sn-P合金中添加0.1at%（0.04质量%）的Mg，降低了Cu基体中的Ni和P的溶解量，导致较低的应力松弛阻力。向Cu-Ni-Sn-P合金中添加0.1at%（0.09质量%）Fe对于改善应力松弛性能是有效的。
The effects of alloying elements on the stress relaxation property of Cu-Ni-Sn-P alloys have been investigated using Cu, Cu-1.5 at% (1.4 mass%) Ni alloys, Cu-0.75 at% (0.7 mass%) Ni-0.75 at% (1.4 mass%) Sn alloys and Cu-1.5 at% (2.8 mass%) Sn alloys with and without 0.14 at% (0.07 mass%) P. Adding Sn to Cu enhances the resistance to stress relaxation by dragging atmospheres of Sn atoms behind dislocations. The Cu-Ni-P alloy exhibits better stress relaxation property than the Cu-Ni and Cu-P alloys, probably because atoms caused by pairs of P and Ni chemical binding are dragged by moving dislocations. Annealing of the Cu alloys with P at a low temperature of 300°C for a short time brings about higher stress-relaxation resistance. This is ascribed to the decrease in mobile dislocation density by segregation of P atoms on dislocations during the annealing. Adding 0.1 at% (0.04 mass%) Mg to the Cu-Ni-Sn-P alloy decreases the amounts of Ni and P dissolved in the Cu matrix, resulting in lower stress-relaxation resistance. The addition of 0.1 at% (0.09 mass%) Fe to the Cu-Ni-Sn-P alloy is effective for the improvement of stress relaxation property.