MEMS-capacitive pressure sensor fabricated using printed-circuit-processing techniques
MEMS-capacitive pressure sensor fabricated using printed-circuit-processing techniques
复制标题
DOI：
10.1109/jsen.2006.884430
复制
发表时间：
2006-12-01
影响因子：
4.3
通讯作者：
Ramadoss, Ramesh
中科院分区：
文献类型：
--
作者：
Palasagaram, Jithendra N.;Ramadoss, Ramesh
基于微机电系统（MEMS）的电容式压力传感器通常使用硅微机械加工技术来制造。本文报道了一种新型的基于液晶聚合物（LCP）的MEMS电容式压力传感器，该传感器采用印刷电路工艺制作。该压力传感器由一个圆柱形腔体组成，该腔体由LCP基板、具有圆孔的LCP间隔层和LCP顶层的夹层结构形成。电容式压力传感器的底部电极和顶部电极分别限定在LCP基板的顶侧和顶部LCP层的底侧上。具有1.6mm的隔膜半径的示例压力传感器对于0-100 kPa范围内的施加压力提供0.277pF的总电容变化。
Microelectromechanical systems (MEMS)-based capacitive pressure sensors are typically fabricated using silicon-micromachining techniques. In this paper, a novel liquid-crystal polymer (LCP)-based MEMS-capacitive pressure sensor, fabricated using printed-circuit-processing technique, is reported. The pressure sensor consists of a cylindrical cavity formed by a sandwich of an LCP substrate, an LCP spacer layer with circular holes, and an LCP top layer. The bottom electrode and the top electrode of the capacitive pressure sensor are defined on the top side of the LCP substrate and the bottom side of the top-LCP layer, respectively. An example pressure sensor with a diaphragm radius of 1.6 mm provides a total capacitance change of 0.277 pF for an applied, pressure in the range of 0-100 kPa.