Excursion Yield Loss and Cycle Time Reduction in Semiconductor Manufacturing
Excursion Yield Loss and Cycle Time Reduction in Semiconductor Manufacturing
复制标题
半导体制造中的偏移良率损失和周期时间缩短
DOI：
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发表时间：
2011
影响因子：
5.6
通讯作者：
Shengwei Ding
中科院分区：
文献类型：
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作者：
R. Leachman;Shengwei Ding
从降低库存成本和更快地响应市场的意义上来说，缩短周期时间的重要性对于半导体制造业来说是众所周知的。不太强调的是，整体芯片良率也与周期时间密切相关。特别是，当工艺或设备超出规格时，一些产量损失是由于“偏差”造成的。虽然一些甚至大多数偏移是通过在线检查检测到的，但有些偏移直到制造后在探测区域对晶圆进行测试后才被检测到。较长的生产周期将导致生产中的大量晶圆因此类偏移而导致加工缺陷。本文介绍了分析公式，用于量化由于直到生产线末端测试才检测到的偏差而造成的收入损失，作为制造周期时间、偏差概率和杀灭率的函数。这些公式提供了一种评估由于周期时间缩短而带来的收入收益的方法，其基础是半导体产品的平均销售价格以可预测的速度稳步下降的假设。
The importance of cycle time reduction is well known to the semiconductor manufacturing industry in the sense of reduced inventory costs and faster response to the market. Less emphasized is the fact that the overall die yield is also closely related to cycle time. In particular, some yield losses are due to “excursions,” when process or equipment shift out of specifications. While some and perhaps most excursions are detected by in-line inspections, some are not detected until the wafers are tested in the probing area after fabrication. A long production cycle time will expose significant amounts of wafers in production to defective processing by such excursions. This paper introduces analytical formulas to quantify the revenue losses due to excursions not detected until end-of-line testing as a function of manufacturing cycle time, excursion probabilities and kill rates. The formulas provide a means to evaluate the revenue gains due to cycle time reduction, based on the assumption that the average selling prices of semiconductor products are declining steadily at predictable rates.