Copper deposition at segmented, reticulated vitreous carbon cathode in Hull cell
Copper deposition at segmented, reticulated vitreous carbon cathode in Hull cell
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DOI：
10.1179/174591910x12646070884872
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发表时间：
2010-03-01
影响因子：
1.9
通讯作者：
Walsh, F. C.
中科院分区：
文献类型：
--
作者：
Tangirala, R. C.;Low, C. T. J.;Walsh, F. C.
在船体电解槽中研究了从酸性硫酸盐溶液中电沉积铜的过程。在pH 2和298 K下，在含有50、75和100 mmol dm（-3）CuSO ↓ [4]的0.5 mol dm（-3）Na ↓ [2] SO ↓ [4]的静态和搅拌电解液中，比较了向平板电极和RVC电极的传质速率。将阴极分成10个相等的部分，并在高达140 mA的恒定电流下获得每个部分的电流-电位曲线。阴极上的电流分布随沿阴极的距离沿着呈对数衰减;最靠近阳极的区段经历了最高的铜沉积速率。
The electrodeposition of copper from an acid sulphate solution has been studied in a Hull cell fitted with four types of cathode; a carbon plate or a reticulated vitreous carbon (RVC) sheet was used either in a continuous or segmented form. The rates of mass transport to the planar plate and RVC electrodes have been compared in static and stirred electrolytes containing 50, 75 and 100 mmol dm(-3) CuSO4 in 0.5 mol dm(-3) Na2SO4 at pH 2 and 298 K. The cathodes were divided into 10 equal sections and current vs. potential curves were obtained for each section at a constant current up to 140 mA. The current distribution over the cathodes followed a logarithmic decay with distance along the cathode; segments nearest to the anode experienced the highest rate of copper deposition.