Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules
Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules
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电力电子模块键合线温度循环过程中塑性变形的热机械模拟
DOI：
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发表时间：
2014
期刊：
影响因子：
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通讯作者：
P. Pichler
中科院分区：
文献类型：
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作者：
A. Wright;A. Hutzler;A. Schletz;P. Pichler
对电力电子变流器中键合线尺寸对可靠性的影响进行了建模研究。实验表明，采用细125 μm Al线代替375 μm Al线可以减轻焊线的脱落，并进一步延长电源模块中焊料退化等其他故障来源的寿命。为了研究粘结线尺寸对钢丝起升的影响，通过热-力学模拟估算了有效塑性应变。分别建立了细、粗键合线的三维模型。针对铝结合线在热循环过程中的临界变形，采用了温度相关的双线性塑性模型。还研究了屈服强度差异对细丝的影响。有效塑性应变的最大值和体积平均值在粗、细钢丝和不同屈服强度钢丝之间存在显著差异。模拟结果表明，粗钢丝具有较高的有效塑性应变，与实验结果相吻合。
Modelling was undertaken to investigate the role of bond wire size on reliability in power electronic converters. Experiments have shown that thin 125 μm Al wires used in place of 375 μm Al wires alleviate bond wire lift-off and further outlast other sources of failure such as solder degradation in a power module. To investigate the role of bond-wire size on wire lift-off, the effective plastic strain was estimated through thermo-mechanical simulation. Three-dimensional models were constructed for the thin and thick bond wires, respectively. For the critical deformation of the aluminium bond wires during thermal cycling, a temperature-dependent bi-linear plasticity model was used. The effect of a difference in yield strength for the thin wires was also investigated. Maximum as well as volumetrically averaged values of the effective plastic strain showed significant differences between the thick and thin wires and wires with different yield strengths. The modelling results show higher effective plastic strain for the thick wires - supporting the experimental findings.