Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects
Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects
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DOI：
10.3390/nano9121742
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发表时间：
2019-12-01
期刊：
影响因子：
5.3
通讯作者：
Tanabe, Katsuaki
中科院分区：
文献类型：
--
作者：
Kishibe, Kodai;Hirata, Soichiro;Tanabe, Katsuaki
提出并展示了一种由光波长转换材料介导的半导体晶圆键合新概念。该制造方案可同时形成键合和产生界面功能，从而实现高效的器件生产。通过利用一种嵌入荧光颗粒的粘性有机胶粘剂基质，实现了波长转换功能化的半导体界面工程。这种键合在室温下的环境空气中进行，因此在器件制造方面具有成本优势。验证了从紫外到可见光的明显波长转换，以及键合界面的高机械稳定性和导电性，证明了它们在实际应用中的通用性。这种键合和界面方案可以通过使光谱光入射适合每种光伏材料来提高光电器件（如太阳能电池）的性能和结构灵活性，并且通过将各自优选的频率传递给光放大器、调制器、波导和探测器材料来提高光子集成电路的性能和结构灵活性。
A new concept of semiconductor wafer bonding, mediated by optical wavelength conversion materials, is proposed and demonstrated. The fabrication scheme provides simultaneous bond formation and interfacial function generation, leading to efficient device production. Wavelength-converting functionalized semiconductor interfacial engineering is realized by utilizing an adhesive viscous organic matrix with embedded fluorescent particles. The bonding is carried out in ambient air at room temperature and therefore provides a cost advantage with regard to device manufacturing. Distinct wavelength conversion, from ultraviolet into visible, and high mechanical stabilities and electrical conductivities in the bonded interfaces are verified, demonstrating their versatility for practical applications. This bonding and interfacial scheme can improve the performance and structural flexibility of optoelectronic devices, such as solar cells, by allowing the spectral light incidence suitable for each photovoltaic material, and photonic integrated circuits, by delivering the respective preferred frequencies to the optical amplifier, modulator, waveguide, and detector materials.