Study of the Dynamic Recrystallization Process of the Inconel625 Alloy at a High Strain Rate
Study of the Dynamic Recrystallization Process of the Inconel625 Alloy at a High Strain Rate
复制标题
Inconel625合金高应变率动态再结晶过程研究
DOI：
10.3390/ma12030510
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发表时间：
2019-02-01
期刊：
影响因子：
3.4
通讯作者：
Ding, Yutian
中科院分区：
文献类型：
--
作者：
Jia, Zhi;Gao, Zexi;Ding, Yutian
采用高温压缩和电子背散射衍射 (EBSD) 技术对 Inconel625 合金的动态再结晶 (DRX) 行为和织构演变进行了系统研究。获得了Inconel625在900~1200℃、应变速率10、1、0.1、0.01 s(-1)条件下的真应力-真应变曲线和本构方程。在热压缩过程中观察到绝热加热效应。在高应变速率下，随着温度升高，晶粒先细化后长大，大角度晶界比例增加。动态再结晶的体积分数增加。大部分晶粒呈随机分布，再结晶织构成分比例先增加后减少。 1100℃时发生完全动态再结晶，此时再结晶体积分数和晶粒随机分布率达到最大值。研究表明，Inconel625合金在高应变速率下的动态再结晶机制包括亚晶合并和旋转的连续动态再结晶，以及孪晶引起的晶界膨胀的不连续动态再结晶。后一种机制不太占主导地位。
High-temperature compression and electron backscatter diffraction (EBSD) techniques were used in a systematic investigation of the dynamic recrystallization (DRX) behavior and texture evolution of the Inconel625 alloy. The true stress-true strain curves and the constitutive equation of Inconel625 were obtained at temperatures ranging from 900 to 1200 degrees C and strain rates of 10, 1, 0.1, and 0.01 s(-1). The adiabatic heating effect was observed during the hot compression process. At a high strain rate, as the temperature increased, the grains initially refined and then grew, and the proportion of high-angle grain boundaries increased. The volume fraction of the dynamic recrystallization increased. Most of the grains were randomly distributed and the proportion of recrystallized texture components first increased and then decreased. Complete dynamic recrystallization occurred at 1100 degrees C, where the recrystallized volume fraction and the random distribution ratios of grains reached a maximum. This study indicated that the dynamic recrystallization mechanism of the Inconel625 alloy at a high strain rate included continuous dynamic recrystallization with subgrain merging and rotation, and discontinuous dynamic recrystallization with bulging grain boundary induced by twinning. The latter mechanism was less dominant.