Sn Whisker Growth During Mechanical Loading and Unloading: Highlighting the Critical Role of Stress in Whisker Growth
Sn Whisker Growth During Mechanical Loading and Unloading: Highlighting the Critical Role of Stress in Whisker Growth
复制标题
机械装载和卸载过程中锡晶须的生长：强调应力在晶须生长中的关键作用
DOI：
10.1007/s11664-022-10080-4
复制
发表时间：
2023
影响因子：
2.1
通讯作者：
Chason, Eric
中科院分区：
文献类型：
--
作者：
Jagtap, Piyush;Jain, Nupur;Bower, Allan;Chason, Eric
在过去的几十年里，金属涂层中晶须的形成得到了广泛的研究。人们普遍认为应力是晶须生长的驱动力。然而，许多细节还不清楚，其他理论也被提出来挑战基于压力的解释。在本文中，我们通过证明可以通过施加和去除机械载荷来开启和关闭晶须生长，量化了应力驱动的晶须生长动力学。我们观察到，（i）在加载阶段形成的晶须随时间线性增长，（ii）他们停止后不久，负载被删除，和（iii）他们恢复增长时，重新施加负载。使用有限元分析（FEA）的应力演变，由于施加的负载和平均增长率预测的实验结果进行解释。这些结果对涂层经受应力的应用具有影响，例如，由于紧固件或热循环。
Whisker formation in metallic coatings has been studied extensively over the past few decades. A wide consensus exists for stress as a driving force behind whisker growth. However, many of the details are not understood, and other theories have been proposed that challenge stress-based explanations. In this paper, we quantify the kinetics of stress-driven whisker growth by demonstrating that the whisker growth can be turned on and off by application and removal of mechanical load. We observed that (i) whiskers formed during the loading stage grow linearly with time, (ii) they stop growing soon after the load was removed, and (iii) they resume growth when the load was reapplied. The experimental results are explained using finite element analysis (FEA) of stress evolution due to applied load and average growth rate predictions. The results have implications for applications in which the coatings experience stresses, for example, due to fasteners or thermal cycling.