Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages
Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages
复制标题
材料特性与各向异性导电胶倒装芯片封装可靠性性能的相关性
DOI：
10.1109/tcapt.2004.843175
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发表时间：
2005
影响因子：
--
通讯作者：
L. K. Teh
中科院分区：
文献类型：
--
作者：
M. Teo;S. Mhaisalkar;E. Wong;P. Teo;C. Wong;K. Ong;C. F. Goh;L. K. Teh
各向异性导电胶（ACA）是一种很有前途的焊料替代候选人，显示出进一步减少间距的潜力。虽然对ACA节点性能的研究已有很多成果，但对材料性能与可靠性性能的相关性研究还很缺乏。本研究的主要目的是确定材料性能对可靠性的影响，从而设计出高可靠性的微电子组件。选择了四种具有不同性能的代表性ACA材料（薄膜和糊状）。材料性能的特点是尽可能接近“压力测试”的条件，以便允许更准确的相关性预测。通过将200-/spl mu/m间距的测试芯片组装到BT基板上，然后对其进行可靠性测试，获得可靠性性能。进行了相关性分析，并确定了有助于良好可靠性性能的关键材料特性。研究结果表明，高可靠性组件的最佳性能是：经过“应力老化”后的高粘合强度，低的湿膨胀系数（CME）和低的弹性模量（E）。
The anisotropic conductive adhesive (ACA) is a promising solder alternative candidate that shows potential for further pitch reduction. Although much work has been published on ACA joint behavior, study on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected. Material properties were characterized as close as possible to "stress test" conditions so as to allow more accurate correlation predictions. Reliability performance was obtained by assembling test chips of 200-/spl mu/m pitch onto BT-substrates, then subjecting them to reliability tests. Correlation analysis was conducted and key material properties that contributed to good reliability performance were identified. Findings indicated that the best properties for high reliability assemblies were: high adhesion strength after subjecting to "stress aging", low coefficient of moisture expansion (CME) and low elastic modulus (E).