Kinetics of the Deposition of Alumina Particles from Copper Sulfate Plating Baths
Kinetics of the Deposition of Alumina Particles from Copper Sulfate Plating Baths
复制标题
硫酸铜镀液中氧化铝颗粒沉积的动力学
DOI：
10.1149/1.2133102
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发表时间：
1977
影响因子：
3.9
通讯作者：
J. Roos
中科院分区：
文献类型：
--
作者：
J. Celis;J. Roos
1972年，Guglielmi提出了一个物理模型，描述了电解槽中惰性粒子的共沉积机理。提出的机制是基于两个连续的吸附步骤。本文作者证明了从酸化硫酸铜镀液中共沉积氧化铝和铜的机理的有效性。从实验导出的电解条件和共沉积之间的关系，吸附到铜离子的还原的重要性示出。根据Guglielmi提出的机理讨论了一价阳离子如铊的影响。
In 1972 Guglielmi proposed a physical model describing the codeposition mechanism of inert particles from electrolytic baths. The proposed mechanism was based on two successive adsorption steps. The present authors demonstrated the validity of that mechanism for the codeposition of alumina and copper from acidified copper sulfate plating baths. From an experimentally derived relationship between electrolytic conditions and codeposition, the importance of the reduction of copper ions adsorbed onto is shown. The influence of monovalent cations like thallium is discussed based on the mechanism proposed by Guglielmi.