Future media manufacturing - More than just conventional sputtering
Future media manufacturing - More than just conventional sputtering
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DOI：
10.1109/20.824427
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发表时间：
2000-01-01
影响因子：
2.1
通讯作者：
Scherer, J
中科院分区：
文献类型：
--
作者：
Cord, B;Scherer, J
讨论了硬盘真空加工的进一步发展趋势。未来的工具应该提供扩展的工艺能力，例如原位基片清洁、多层结构的沉积、基片温度的快速上升和高能沉积。设计上的挑战将是使这些步骤--其中许多已经用于其他真空应用--适应磁盘制造中常见的2-5 S工艺时间。
Trends for further developments in vacuum processing of hard disks are discussed. Future tools should offer extended process capabilities such as in situ substrate cleaning, deposition of multilayer structures, fast ramping of substrate temperature, and high energy deposition. The design challenge will be to adapt these steps-many of them already used in other vacuum applications-to the 2-5 s process times common in disk manufacturing.