High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
复制标题
具有相变粘合中间层的高精度热成型 3D 适形电子产品
DOI：
10.3390/mi10030160
复制
发表时间：
2019-02-26
期刊：
影响因子：
3.4
通讯作者：
Wu, Zhigang
中科院分区：
文献类型：
--
作者：
Wu, Kang;Zhou, Qifeng;Wu, Zhigang
现代产品的设计意识促进了先进电子制造技术的发展。这些广泛使用的工业技术显示出与无机材料的高度兼容性和大规模生产的能力。但是，形貌精度难以保证，容易产生裂纹，导致器件性能和寿命下降。为了制作高精度三维适形电子器件，在自行研制的设备上采用了热相变粘接中间层和改进的制作工艺。定量地研究了加热时间、几何参数等因素对加热效果的影响。这种新技术和蛇形设计的结构提高了制造图案的精度。分层或分离明显减轻。由于操作方便，与现有材料的兼容性，所提出的制造方法具有很大的潜力，大规模生产的3D曲面适形电子产品。
Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happen easily, which could cause the degradation of device performance and life span. In order to make high precision 3D conformable electronics, a thermal phase-changing adhesion interlayer and modified fabricating processes are used in self-developed equipment. The working principles and influencing factors such as heating time and geometry parameters are studied quantitatively. The accuracy of fabricated patterns is enhanced by this new technology and serpentine designed structures. The delamination or detachment are significantly alleviated. Due to the operation convenience and compatibility with existing materials, the presented fabrication method has great potential for mass production of 3D curved conformable electronics.