Reduced temperature sensitivity of the wavelength of a diode laser in a stress-engineered hydrostatic package
Reduced temperature sensitivity of the wavelength of a diode laser in a stress-engineered hydrostatic package
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应力工程静压封装中二极管激光器波长的温度敏感性降低
DOI：
10.1063/1.118137
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发表时间：
1996
影响因子：
4
通讯作者：
L. Coldren
中科院分区：
文献类型：
--
作者：
D. Cohen;M. Heimbuch;L. Coldren
通过利用增加静水压力的效应来抵消温度升高的影响，我们展示了一种稳定非冷却二极管激光器波长的技术。我们利用激光器封装中各种材料之间的差异热膨胀来自动生成与温度相关的压力，并使 1.55 μm GaInAsP/InP 激光器波长的温度敏感性降低 50%。
By using the effects of increasing hydrostatic pressure to counteract the effects of rising temperature, we demonstrate a technique to stabilize the wavelength of an uncooled diode laser. We use the differential thermal expansion between various materials incorporated into the laser package to automatically generate a temperature‐dependent pressure, and obtain a 50% reduction in the temperature sensitivity of the wavelength of a 1.55 μm GaInAsP/InP laser.