Measurement of Biaxial Stress Using Grown Grain Density Rate in Electrodeposited Copper Foil with a Microcircular Hole.
Measurement of Biaxial Stress Using Grown Grain Density Rate in Electrodeposited Copper Foil with a Microcircular Hole.
复制标题
使用微圆孔电解铜箔中的生长晶粒密度率测量双轴应力。
DOI：
10.1299/kikaia.69.565
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
M. Nakagawa
中科院分区：
文献类型：
--
作者：
S. Kitaoka;Y. Ono;M. Nakagawa
为了测量具有微圆孔的电沉积铜箔的双轴应力，使用铜箔中微圆孔周围的滑移带的出现率和铜箔本身中生长晶粒出现的循环数。然而，有必要经常停止测试以寻求后者。在这份报告中，为了克服这一弱点，使用的可能性生长晶粒密度，这可以得到任意数量的周期，检查。即用三种材料粘附的铜箔，在平面弯曲和循环扭转的组合作用下，研究了控制铜箔晶粒长大密度的应力分量，给出了晶粒长大密度与应力幅和循环次数之间的基本关系式。
In order to measure biaxial stresses by an electrodeposited copper foil with a microcircular hole both occurrence rate of slip bands at the periphery of microcircular holes in a copper foil and the number of cycles of grown grain occurrence in copper foil itself are used. However, it is necessary to stop the test frequently to seek the latter. In this report, in order to overcome this weakness, the posssibility of the use of grown grain density, which can be obtained to optional number of cycles, is examined. Namely, using three kinds of material adhered copper foil, the stress component which controlls the grown grain density in copper foil is examined under the combination of plane bending and cyclic torsion and the basic equations connecting the grown grain density, the stress amplitude and number of cycles are presented.