Direct-cooled power module with a thick Cu heat spreader featuring a stress-suppressed structure for EV/HEV inverters
Direct-cooled power module with a thick Cu heat spreader featuring a stress-suppressed structure for EV/HEV inverters
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用于 EV/HEV 逆变器的带厚铜散热器的直冷式功率模块，具有应力抑制结构
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
T. Hayashi
中科院分区：
文献类型：
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作者：
Keiichiro Numakura;K. Emori;Yusuke Yoshino;Y. Hayami;T. Hayashi
本文介绍了满足低热阻和应力松弛要求的直接冷却功率模块技术，特别是对于小芯片尺寸半导体（例如碳化硅（SiC））。功率模块结构的特点是位于半导体芯片下方的厚铜（Cu）散热器用于降低热阻，以及薄封闭铝（Al）水套用于应力松弛。采用厚Cu散热器制造了原型功率模块，与传统的直接冷却功率模块相比，该散热器将热阻降低了34%。还表明，使用薄的封闭Al水套（多端口管）实现了与传统功率模块相同的应力水平，从而减轻了由具有厚Cu结构的金属结引起的应力应变和焊料开裂。
This paper presents direct-cooled power module technologies that satisfy the requirements for lower thermal resistance and stress relaxation, especially for small die size semiconductors (e.g. Silicon Carbide (SiC)). The power module structure features a thick Copper (Cu) heat spreader located under the semiconductor chip for lower thermal resistance and a thin closed Aluminum (Al) water jacket for stress relaxation. And a prototype power module was fabricated using a thick Cu heat spreader that reduces thermal resistance by 34% compared with conventional direct-cooled power modules. It was also shown that using a thin closed Al water jacket (multi-port tube) achieves the same level of stress as conventional power modules, thereby mitigating the stress-strain and solder cracking induced by the metal junctions with a thick Cu structure.