Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag-Cu-Ti plus SiCp composite filler
Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag-Cu-Ti plus SiCp composite filler
复制标题
Ag-Cu-Ti+SiCp复合填料钎焊Si3N4/Si3N4接头的显微组织演化
作者:
Zhang, J.;He, Y. M.;Sun, Y.;Liu, C. F.