Micro grinding with ultra small micro pencil grinding tools using an integrated machine tool
Micro grinding with ultra small micro pencil grinding tools using an integrated machine tool
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DOI：
10.1016/j.cirp.2015.04.011
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发表时间：
2015-01-01
影响因子：
4.1
通讯作者：
Walk, Michael
中科院分区：
文献类型：
--
作者：
Aurich, Jan C.;Carrella, Marina;Walk, Michael
微磨削在加工硬脆材料中的微结构时提供了很高的潜力。在这种情况下，开发了一种新的机床-纳米磨削中心，它允许制造和应用超小的微型铅笔磨削工具，而无需重新夹紧。利用这种新型机床，研究了在40 μ m和4 μ m两种直径的磨具对硅进行微磨削时，晶粒尺寸、晶粒浓度和工艺参数对材料去除机理的影响。对加工力、表面质量和精度进行了测量，并对结果进行了讨论。(C)2015年CIRP。
Micro grinding offers a high potential when machining micro structures in hard and brittle materials. In this context, a new machine tool - the nano grinding center - was developed, which allows to manufacture and apply ultra small micro pencil grinding tools without re-clamping. With this new machine tool, the influence of grain size, grain concentration, and process parameters on the material removal mechanisms was investigated during micro grinding of silicon with grinding tool diameters of 40 mu m and 4 mu m. Measurements of process forces, surface quality and accuracy were carried out and the results are discussed. (C) 2015 CIRP.