Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste
Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste
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DOI：
10.1143/jjap.45.6987
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发表时间：
2006-09
影响因子：
1.5
通讯作者：
Chun-An Lu;P. Lin;Hong-ching Lin;Sea-Fue Wang
中科院分区：
文献类型：
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作者：
Chun-An Lu;P. Lin;Hong-ching Lin;Sea-Fue Wang
以银片、α-松油醇和各种金属有机分解物为原料，制备了6种低温固化银浆。测定了该浆料的热分解行为。对热处理后氧化铝基板上丝网印刷膜的微观结构和导电性进行了表征和讨论。结果表明，2-乙基己酸酯的热分解温度最低（190.3 °C），能形成银颗粒，促进片状银的连接，使电阻率在200 °C时降至<13 µΩ·cm。
Six low-temperature-curing silver pastes were prepared from silver flake, α-terpineol and various metallo-organic decomposition (MOD) compounds. The thermal decomposition behaviors of the pastes were determined. The microstructures and resistivities of screen-printed films on alumina substrate after thermal treatment were characterized and discussed. Results indicated that 2-ethylhexanoate possesses the lowest decomposition temperature (190.3 °C) among the MOD agents studied, and it forms silver particles to promote the linking of silver flake powders and thus reduces the resistivity to <13 µΩ·cm at a temperature as low as 200 °C.