Ion Implanted Lateral p+-i-n+ Diodes on HPSI 4H-SiC
Ion Implanted Lateral p+-i-n+ Diodes on HPSI 4H-SiC
复制标题
HPSI 4H-SiC 上的离子注入横向 p-i-n 二极管
DOI:
10.4028/www.scientific.net/msf.821-823.620
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发表时间:
2015
期刊:
影响因子:
--
通讯作者:
M. V. Rao
中科院分区:
文献类型:
--
作者:
R. Nipoti;F. Moscatelli;A. Roncaglia;F. Bonafè;F. Mancarella;P. de Nicola;A. Nath;M. V. Rao
Square shaped annular lateral p+–i–n+ diodes on high purity semi-insulating (HPSI) 4H-SiC are fabricated by Al+ and P+ ion implantation to obtain anode and cathode regions, respectively. All the diodes have the same size central anode surrounded by an intrinsic region, which is surrounded by an annular cathode. Anode area and annular cathode width are fixed for all diodes, only the lateral length of the intrinsic region is varied. Post implantation annealing is performed at 1950 °C for 10 min. Static forward and reverse characteristics are measured in the temperature range of 30 - 290 °C. For all diodes, the reverse current is below the instrument detection limit of 10-14 A up to 100 °C at 200 V, the maximum reverse bias employed in this study. The reverse current increased up to low 108 A for 200 V reverse bias at 290 °C. Forward currents overlap at the low voltage region once they exceed the instrument detection limit at ~1.6 V and 30 °C. The forward currents follow almost identical exponential trend at all measured temperatures while the diode series resistance increase with increasing anode-cathode distance and decreased with increasing temperature for the given intrinsic region lateral length.