Three-dimensional microarchitected materials and devices using nanoparticle assembly by pointwise spatial printing.

Three-dimensional microarchitected materials and devices using nanoparticle assembly by pointwise spatial printing.
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DOI:
10.1126/sciadv.1601986
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发表时间:
2017-03
期刊:
影响因子:
13.6
通讯作者:
Panat R
Panat R
中科院分区:
综合性期刊1区
文献类型:
--
作者:
Saleh MS;Hu C;Panat R

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纳米颗粒可以使用增材打印在空间中组装,以创建复杂的分层3D微结构和纳米结构材料。三维(3D)分层材料对广泛的新兴技术应用非常重要。我们报告了一种方法来合成复杂的三维微工程材料,如微晶格,具有几乎完全密集的桁架单元,最小直径约为20 μm,具有高纵横比(高达20:1),而不使用任何模板或支撑材料。通过改变后处理条件,我们还引入了对桁架元件内部孔隙度的额外控制,以展示具有整体空隙尺寸和特征尺寸控制超过五个数量级长度的分层多孔结构。该方法使用气溶胶喷射技术在3D空间中直接打印纳米颗粒分散体,无需模板或支撑材料,然后去除粘合剂并烧结。除了3D微晶格外,我们还展示了直接打印的可拉伸互连,螺旋和柱。这种组装方法可以通过多种微滴生成方法来实现,用于快速大规模制造分层材料,用于组织工程,超轻或多功能材料,微流体和微光电子学。
Nanoparticles can be assembled in space using additive printing to create complex hierarchical 3D microarchitected and nanoarchitected materials. Three-dimensional (3D) hierarchical materials are important to a wide range of emerging technological applications. We report a method to synthesize complex 3D microengineered materials, such as microlattices, with nearly fully dense truss elements with a minimum diameter of approximately 20 μm and having high aspect ratios (up to 20:1) without using any templating or supporting materials. By varying the postprocessing conditions, we have also introduced an additional control over the internal porosity of the truss elements to demonstrate a hierarchical porous structure with an overall void size and feature size control of over five orders of magnitudes in length scale. The method uses direct printing of nanoparticle dispersions using the Aerosol Jet technology in 3D space without templating or supporting materials followed by binder removal and sintering. In addition to 3D microlattices, we have also demonstrated directly printed stretchable interconnects, spirals, and pillars. This assembly method could be implemented by a variety of microdroplet generation methods for fast and large-scale fabrication of the hierarchical materials for applications in tissue engineering, ultralight or multifunctional materials, microfluidics, and micro-optoelectronics.