Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper
Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper
复制标题
铜双晶结构的晶粒和晶界强度的结晶度依赖性
DOI：
10.1115/imece2020-23757
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
Luo Yifan
中科院分区：
文献类型：
--
作者：
Suzuki Ken;Fan Yiqing;Luo Yifan
电镀铜薄膜往往含有多孔晶界，且铜薄膜中多孔晶界的体积比远大于块体铜。因此，通过电镀制造的互连组件的寿命很大程度上取决于晶界的强度，因为电迁移（EM）过程中原子扩散加速引起的最终断裂发生在多晶互连的晶界处。因此，定量评估电镀铜膜的晶界强度对于估计互连的寿命以确保产品的可靠性非常重要。在这项研究中，从实验和理论上研究了电镀铜薄膜的强度和结晶度之间的关系。为了研究强度和晶界质量之间的关系，采用分子动力学（MD）模拟来分析双晶样品的变形行为及其强度。强度和变形性能的变化归因于晶界周围较高的缺陷密度。
Electroplated copper thin films often contain porous grain boundaries and the volume ratio of porous grain boundaries in the copper thin films is much larger than that in bulk copper. Thus, the lifetime of the interconnection components fabricated by electroplating is strongly dominated by the strength of grain boundaries because final fracture caused by the acceleration of atomic diffusion during electromigration (EM) occurs at grain boundaries in polycrystalline interconnections. It is important, therefore, to quantitatively evaluate the grain boundary strength of electroplated copper films for estimating the lifetime of the interconnection in order to assure the product reliability. In this study, relationship between the strength and crystallinity of electroplated copper thin films was investigated experimentally and theoretically. In order to investigate the relationship between the strength and grain boundary quality, molecular dynamics (MD) simulations were applied to analyze the deformation behavior of a bicrystal sample and its strength. The variation of the strength and deformation property were attributed to the higher defect density around grain boundaries.