Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits
Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits
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DOI：
10.1016/j.surfcoat.2011.01.012
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发表时间：
2011-03-15
影响因子：
5.4
通讯作者：
Philippe, Laetitia
中科院分区：
文献类型：
--
作者：
Pathak, Siddhartha;Guinard, Marion;Philippe, Laetitia
用很低的电流密度（1.5-5 mA·cm（-2））从氨基磺酸盐镀液中制备了厚度为18 - 90 μ m的厚镍镀层。随着电流密度的增加，晶粒尺寸增加，硬度值相应降低，并且观察到更多的柱状晶形貌。发现沉积物的机械性能的各向异性与存款织构强烈相关，其中从< 101 >1.5 mA cm（-2）下的主导取向到< 001 >较高（5 mA cm（-2））电流密度下的取向的变化导致相应Ni膜的压痕模量值的相应降低。发现在沉积物中测得的残余应力值（75-136 MPa）与在较高电流密度下镀覆的沉积物的文献值相当，这排除了使用这种低电流密度产生较低残余应力的任何潜在优点。(C)2011爱思唯尔有限公司版权所有。
Thick Ni electrodeposits, with thicknesses ranging from 18 to 90 mu m, have been produced from sulfamate baths using very low current densities (1.5-5 mA cm(-2)). Increasing grain sizes, with a corresponding decrease in the hardness values, and more columnar grain morphologies were observed with increasing current densities in the deposits. The anisotropy in the mechanical properties of the deposits were found to correlate strongly with the deposit texture, where the change from a < 101 > dominated orientation at 1.5 mA cm(-2) to a < 001 > orientation at the higher (5 mA cm(-2)) current density led to a corresponding decrease in the indentation modulus values for the respective Ni films. The residual stress values measured in the deposits (75-136 MPa) were found to be comparable to literature values of deposits plated at higher current densities, which rules out any potential advantage from the use of such low current densities for producing lower residual stresses. (C) 2011 Elsevier B.V. All rights reserved.