On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls
On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls
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DOI：
10.1007/s11664-020-08508-w
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发表时间：
2020-10-15
影响因子：
2.1
通讯作者：
Gourlay, C. M.
中科院分区：
文献类型：
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作者：
Daszki, A. A.;Gourlay, C. M.
Sn-Ag-Cu (SAC) 焊点的微观结构在电子产品的可靠性中发挥着重要作用，而交错孪晶与性能的提高有关。在这里，我们通过将连续切片与电子背散射衍射相结合，研究了 Sn-3.0Ag-0.5Cu (SAC305) 焊球中交错区域的三维 (3-D) 形状。在没有大 Ag3Sn 板的焊球中，我们表明交错体积可以合理地近似为空心双锥体，其中共同的 <100> 孪生轴作为锥体轴，来自所有三个孪生方向的 <110> 构成锥体侧面。这种 3D 形态可以解释过去 2D 横截面工作中一系列部分交错的形态。
The microstructure of Sn-Ag-Cu (SAC) solder joints plays an important role in the reliability of electronics, and interlaced twinning has been linked with improved performance. Here, we study the three-dimensional (3-D) shape of interlaced regions in Sn-3.0Ag-0.5Cu (SAC305) solder balls by combining serial sectioning with electron backscatter diffraction. In solder balls without large Ag3Sn plates, we show that the interlaced volume can be reasonably approximated as a hollow double cone with the common < 100 > twinning axis as the cone axis, and the < 110 > from all three twinned orientations making up the cone sides. This 3-D morphology can explain a range of partially interlaced morphologies in past work on 2-D cross-sections.