Prognosis of wire bond lift-off fault of an IGBT based on multisensory approach

Prognosis of wire bond lift-off fault of an IGBT based on multisensory approach
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DOI:
10.1109/apec.2016.7468291
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发表时间:
2016-03
期刊:
2016 IEEE Applied Power Electronics Conference and Exposition (APEC)
影响因子:
--
通讯作者:
M. Haque;J. Baek;Joseph Herbert;Seungdeog Choi
M. Haque;J. Baek;Joseph Herbert;Seungdeog Choi
中科院分区:
其他
文献类型:
--
作者:
M. Haque;J. Baek;Joseph Herbert;Seungdeog Choi

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The safe and continuous operation of the power switches of the inverter units is vital in assisting the functioning of the inverter units. This paper proposes an algorithm for the condition monitoring and prognosis of wire-bond fault in an IGBT- extensively used power switch in inverter systems. The proposed algorithm employs both on-state collector emitter voltage and collector current in the estimation of IGBT junction temperature. These two signals complement each other as thermal sensitive electrical parameters and results in better estimation of junction temperature. This algorithm has integrated a stochastic method and Coffin Manson model to introduce criticality matrix which is used to determine the necessity for IGBT replacement. Both simulation result and experiment data verified the proposed. The proposed algorithm has the scope to be further modified for the condition monitoring of a more complex system in the future.