Characterization of Deep Defects in Boron-Doped CVD Diamond Films Using Transient Photocapacitance Method
Characterization of Deep Defects in Boron-Doped CVD Diamond Films Using Transient Photocapacitance Method
复制标题
使用瞬态光电容法表征掺硼 CVD 金刚石薄膜的深层缺陷
DOI:
10.1016/j.mssp.2016.12.001
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发表时间:
2017
影响因子:
4.1
通讯作者:
T. Kodama and T. Ito
中科院分区:
文献类型:
--
作者:
O. Maida;T. Hori;T. Kodama and T. Ito
We have developed a highly-sensitive transient photocapacitance measurement (TPM) system for deep defects in wide bandgap materials, and applied it to characterize the boron-doped diamond films grown on a high-pressure/high-temperature-synthesized Ib diamond substrate using high-power-density microwave-plasma chemical vapor deposition method. The developed TPM system has both a low detection limit of less than 0.5 fF for changes in the photocapacitance and a low measurement temperature drift of less than 0.03 K in 12 h. By using the TPM system, we have successfully found an acceptor-type defect around 1.2 eV above the valence-band maximum for the B-doped diamond film with a considerably high crystalline quality that had some strong exciton emission peaks in the cathodoluminescence spectra taken at ≈80 K. The photoionization cross section and the defect density estimated for the observed defect were 3.1×10–15cm2and 2.8×1016cm−3, respectively.