Exact Analysis of the Wire-Bonded Multiconductor Transmission Line
Exact Analysis of the Wire-Bonded Multiconductor Transmission Line
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DOI：
10.1109/tmtt.2007.902084
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发表时间：
2007-08
影响因子：
4.3
通讯作者：
J. E. Page;E. Márquez-Segura;F. P. Casares-Miranda;J. Esteban;P. Otero;C. Camacho-Pealosa
中科院分区：
文献类型：
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作者：
J. E. Page;E. Márquez-Segura;F. P. Casares-Miranda;J. Esteban;P. Otero;C. Camacho-Pealosa
本文给出了带键合线的多导体传输线的精确模型。该模型是基于多端口导纳矩阵，并适用于任何数量的导体的结构。该模型展示了如何计算引线键合结构的二端口导纳矩阵，并直接应用于引线键合叉指电容。该模型已通过基于矩量法的数值模拟和实验工作进行了验证。
In this paper, the exact model of a multiconductor transmission line with bonding wires is presented. The model is based on the multiport admittance matrix, and is valid for any number of conductors in the structure. The model shows how to compute the two-port admittance matrix of the wire-bonded structure with direct application to the wire-bonded interdigital capacitor. The model has been validated by means of method-of-moments-based numerical simulation and by experimental work.