Low-cost high-gain differential integrated 60 GHz phased array antenna in PCB process
Low-cost high-gain differential integrated 60 GHz phased array antenna in PCB process
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DOI：
10.1109/wamicon.2016.7483822
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发表时间：
2016-04
期刊：
影响因子：
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通讯作者：
Zhang Tao;Lianming Li;Hai-yang Xia;Xujun Ma;Dixian Zhao;Jun-hai Cui
中科院分区：
文献类型：
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作者：
Zhang Tao;Lianming Li;Hai-yang Xia;Xujun Ma;Dixian Zhao;Jun-hai Cui
提出了一种基于封装天线（AiP）的60 GHz通信高增益多层差分集成天线方案。采用传统的低成本印刷电路板（PCB）工艺，制作了60 GHz相控阵天线元件和16元相控阵天线样机。对于天线元件，测量结果表明，|的增益约为8.9 dBi，带宽大于15 GHz， |<；- 10db，仿真效率大于90%。对于相控阵，两个波束固定（0度和30度）16元阵列天线的增益分别为16.6 dBi和13.9 dBi。实测结果与模拟结果吻合较好。
We propose a high-gain multilayer differential integrated antenna based on antenna-in-package (AiP) solution for 60 GHz communications. Using the conventional low-cost printed circuit board (PCB) process, the 60 GHz phased array antenna element and 16-element phased array antenna prototype are fabricated. For the antenna element, measurement results show that a gain of about 8.9 dBi and bandwidth more than 15 GHz for |S11|<;-10 dB are achieved in the 60 GHz band, and the simulated efficiency is larger than 90%. For the phased array, two beam-fixed (0 degree and 30 degree) 16-element array antennas achieve gains of 16.6 dBi and 13.9 dBi, respectively. Furthermore, the measured results are in good agreement with simulations.