Effect of Microscopic Structure on High-Cycle Fatigue Behavior in Nano-Components
Effect of Microscopic Structure on High-Cycle Fatigue Behavior in Nano-Components
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DOI：
10.4028/www.scientific.net/amr.891-892.1705
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发表时间：
2014-03
期刊：
影响因子：
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通讯作者：
T. Sumigawa;Kenta Matsumoto;T. Kitamura
中科院分区：
文献类型：
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作者：
T. Sumigawa;Kenta Matsumoto;T. Kitamura
为了研究微观结构对纳米构件疲劳行为的影响，利用纳米构件试件进行了共振疲劳试验，试验段由单晶硅衬底、200 nm厚的铜多晶薄膜和氮化硅非晶层组成。在试件中，只有铜部分发生塑性变形，因为屈服应力低于其他材料的屈服应力。用电子背散射谱(EBSD)确定了铜表面各颗粒的形状和晶向。虽然只在一颗铜颗粒中出现了几十纳米宽的晶体滑移带，但该颗粒与施密德因子所预期的不同。考虑了变形各向异性的有限元分析表明，由于相邻晶体和成分的变形约束，产生滑移带的剪应力集中在晶粒上。
In order to investigate the effect of microscopic structure on fatigue behavior of nanoscale components, a resonant fatigue experiment is conducted using a nanocomponents specimen where the test section is composed of a single crystalline Si substrate, a 200 nm thickness Cu polycrystalline film and a SiN amorphous layer. In the specimen, only the Cu portion plastically deforms because the yield stress is lower than those of other materials. The shape and the crystalline orientation of each grain on the surface of Cu portion are specified by means of EBSD. Although crystallographic slip bands with a width of a few tens of nanometers appear only in a grain of Cu portion, the grain is different from that expected by the Schmid factor. A FEM analysis, which takes into account the deformation anisotropy of grains, reveals that shear stress to generate slip bands is concentrated on the grain owing to the deformation constraint by neighboring crystals and components.