Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect
Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect
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DOI：
10.1109/tmtt.2023.3290189
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发表时间：
2024-01
影响因子：
4.3
通讯作者：
Xuan Ding;Hai-xia Yu;Sajjad Sabbaghi;Q. Gu
中科院分区：
文献类型：
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作者：
Xuan Ding;Hai-xia Yu;Sajjad Sabbaghi;Q. Gu
本文提出了一种基于G波段模式耦合器的亚太赫兹(THz)/THz互连多模多点硅介质波导。分析、设计和论证了四种类型的模式耦合器：$E_{11}^{y}$-$E_{11}^{y}$、$E_{11}^{y}$-$E_{21}^{y}$、$E_{11}^{y}$-$E_{31}^{y}$和准瞬变电磁至$E_{11}^{y}$模式耦合器。准瞬变电磁到E_(11){y}_(？)耦合器是微带线(MSL)到DWG的过渡。具有满意的相位匹配的$E_{11}^{y}$到$E_{21}^{y}$和$E_{11}^{y}$到$E_{31}^{y}$模式耦合器可以在同一波导中多传输两个模式。对耦合系数、耦合效率、串扰和带宽等模式耦合理论进行了数学研究和分析，指导了单边锥形耦合器的研制，提高了带宽。采用锥形结构作为DWG段和模式滤波器之间的平滑过渡，以最小化(解)复用器中的模式干扰，并作为辐射端来减少反射。三种模式的最小跃迁损耗约为5分贝，3分贝带宽分别为14 3~2 0 0 GHz、15 1~185 GHz和15 5~174 GHz，模式间串扰小于−2 6分贝。采用基于CMOS型发射机(TXS)/接收机(RXS)的多模多点亚太赫兹互连系统，获得了65 Gb/S的综合数据速率和1.6pJ/b的能量效率，误码率为10-12美元。
This article presents a $G$ -band mode-coupler-based multimode multidrop Si dielectric waveguide (DWG) for sub-terahertz (THz)/THz interconnect. Four types of mode couplers, including $E_{11}^{y}$ – $E_{11}^{y}$ , $E_{11}^{y}$ – $E_{21}^{y}$ , $E_{11}^{y}$ – $E_{31}^{y}$ , and quasi-TEM to $E_{11}^{y}$ mode couplers, are analyzed, designed, and demonstrated. The quasi-TEM to $E_{11}^{y}$ coupler is a microstrip line (MSL)-to-DWG transition. $E_{11}^{y}$ to $E_{21}^{y}$ and $E_{11}^{y}$ to $E_{31}^{y}$ mode couplers with satisfied phase matching enable two more mode transmissions along the same waveguide. The mode-coupling theory, including the coupling coefficient, the coupling efficiency, crosstalk, and bandwidth, is studied and analyzed mathematically and guides the development of a one-side tapered coupler to boost the bandwidth. Tapered structures are employed as the smooth transition between DWG sections and mode filters to minimize the mode interference in (de)multiplexers and as the radiation terminals to reduce the reflection. The measured minimum transition loss is about 5 dB with the 3-dB bandwidth of 143–200, 151–185, and 155–174 GHz for the three modes, respectively, and the measured crosstalks between modes are less than −26 dB. A multimode multidrop sub-THz interconnect system is also demonstrated with CMOS-based transmitters (TXs)/receivers (RXs) and achieves an aggregate data rate of 65 Gb/s and the energy efficiency of 1.6 pJ/b with a bit error rate (BER) of $10^{-12}$ .