Low cost manufacture of high frequency tunnel device systems
Low cost manufacture of high frequency tunnel device systems
复制标题
高频隧道装置系统的低成本制造
DOI：
--
复制
发表时间：
2002
期刊：
影响因子：
--
通讯作者：
M. J. Kelly
中科院分区：
文献类型：
--
作者：
M. J. Kelly
量产的器件和电路面临着非常大的成本下行压力。卓越的性能对于设备和电路来说是不够的，即使在有明确市场的地方也是如此。为了实现低制造成本，设计必须容忍相关器件参数的波动，制造工艺必须可靠和高度重复性，并且需要用户友好的模拟器来进行开发阶段的逆向工程和制造过程中的第一次正确设计。虽然利用隧穿和共振隧穿的原型器件具有许多吸引人的性能特征，但建立低成本可制造性的过程尚未完成。然而，最近的一些结果是相当有希望的。它们对最终制造包含介观或纳米级特征的设备也有直接影响。
Devices and circuits in volume production are the subject of very strong downward pressure on costs. Superior performance is not enough for devices and circuits, even where there is a clear market. In order to achieve low manufacturing costs, the designs have to be tolerant of fluctuations in relevant device parameters, the fabrication processes have to be reliable and highly reproducible, and a user-friendly simulator is required both for reverse engineering during the development stage and right-first-time design during manufacture. While prototype devices that exploit tunneling and resonant tunneling have many attractive performance features, the process of establishing low-cost manufacturability is as yet incomplete. Some recent results are however quite promising. They also have direct implications for the eventual manufacture of devices that incorporate mesoscopic or nanometer-scale features.