Formulation and Heuristic Algorithms for Multi-Chip Module Substrate Testing
Formulation and Heuristic Algorithms for Multi-Chip Module Substrate Testing
复制标题
多芯片模块基板测试的制定和启发式算法
DOI：
10.1016/j.compeleceng.2012.12.020
复制
发表时间：
2013
影响因子：
4.3
通讯作者：
Keisuke Murakami
中科院分区：
文献类型：
--
作者：
Shimada;Y.;重田祥範・荻原悠季;Keisuke Murakami
多芯片模块(MCM)基板设计用于封装两个或多个半导体芯片。在这些基板上，布线中存在开路故障，即电气断开。因此，我们必须测试基板以检测开路故障，并且必须建立一种有效的测试方法。一种测试方法使用两个探头。使用两个探头，每个探头接触芯片间布线的一个边缘(末端)，以检查是否存在故障。当我们确认MCM基板上不存在故障时，测试即告完成。我们的目标是最大限度地减少完成测试的时间，也就是说，我们的目标是为两个探测器设计有效的路线。在本文中，我们提出了一种新的方法来将路由问题描述为具有覆盖约束的最短路径问题(SPCC)，并针对SPCC提出了三种算法。在计算实验中，我们的公式和算法优于现有的方法。
Multi-chip module (MCM) substrates are designed for packing two or more semiconductor chips. On these substrates, there are open faults in the wiring, which are electrical disconnections. We must therefore test the substrates to detect open faults, and it is essential to establish an efficient method of testing them. One type of test method uses two probes. Two probes, each touching one edge (end) of an inter-chip wiring, are used to check for the presence of faults. Testing is complete when we have confirmed that no faults exist on the MCM substrate. The objective is to minimize the time to complete testing, that is, our aim is to design efficient routes for the two probes. In this paper, we propose a novel approach of formulating the routing problem as a shortest path problem with covering constraints (SPCC) and we also propose three algorithms for the SPCC. In computational experiments, we show that our formulation and algorithms outperform the existing method.