A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
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DOI：
10.1016/j.scriptamat.2015.07.032
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发表时间：
2015-12-01
影响因子：
6
通讯作者：
Moon, Changyoul
中科院分区：
文献类型：
--
作者：
Chu, Kunmo;Sohn, Yoonchul;Moon, Changyoul
研究了两种夹层结构焊料系统（Cu/Sn/Cu 和 Ni/Sn/Ni）的界面反应和低温晶圆键合的机械可靠性。通过改变Cu/Sn（Ni/Sn）的厚度比，研究了化学反应与焊点机械可靠性之间的关系。 Cu/Sn/Cu 接头被证明更坚固，通过 Cu6Sn5 晶粒显示出非常光滑的断裂表面（晶内断裂）。同时，Ni/Sn/Ni接头通过Ni3Sn4晶界和Ni3Sn4/Ni3Sn2相界（晶间断裂）表现出粗糙的断裂表面。 (C) 2015 Acta Materialia Inc. 由 Elsevier Ltd 出版。保留所有权利。
Two sandwich structured solder systems (Cu/Sn/Cu and Ni/Sn/Ni) were investigated in terms of interfacial reaction and mechanical reliability for low temperature wafer bonding. The relationship between chemical reaction and mechanical reliability of the solder joints was investigated by varying thickness ratio of Cu/Sn (Ni/Sn). The Cu/Sn/Cu joint was proved to be stronger, revealing very smooth fractured surface through Cu6Sn5 grains (intragranular fracture). Meanwhile, the Ni/Sn/Ni joint showed rough fractured surface through Ni3Sn4 grain boundaries and Ni3Sn4/Ni3Sn2 interphase boundaries (intergranular fracture). (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.