Continuous microscratch measurements of the practical and true works of adhesion for metal/ceramic systems
Continuous microscratch measurements of the practical and true works of adhesion for metal/ceramic systems
复制标题
对金属/陶瓷系统的实际和真实附着力进行连续微划痕测量
DOI：
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发表时间：
1996
期刊：
影响因子：
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通讯作者：
W. Gerberich
中科院分区：
文献类型：
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作者：
S. Venkataraman;D. Kohlstedt;W. Gerberich
用连续微划痕技术研究了Pt、Cr、Ti和Ta_2N金属化层与NiO和Al_2O_3基体的结合强度。粘附的实际功被确定为厚度和退火条件两者的函数。除Ta_2N膜外，其它膜的实际粘附功随膜厚的增加呈非线性增加，从零点几J/m^2增加到几J/m^2，表明较厚的膜在脱层时消耗了较大的塑性功。此外，粘附的实际功也随着退火温度的增加而增加，表明界面处的结合更强。在薄膜厚度趋于零的极限下，薄膜中的塑性能量耗散趋于零。因此，外推到零厚度即可得出该系统的真实粘附功。
Using a continuous microscratch technique, the adhesion strengths of Pt, Cr, Ti, and Ta_2N metallizations to NiO and Al_2O_3 substrates have been characterized. The practical work of adhesion was determined as a function of both thickness and annealing conditions. For all except the Ta_2N films, the practical work of adhesion increases nonlinearly from a few tenths of a J/m^2 to several J/m^2 as the thickness of the thin film is increased, indicating that a greater amount of plastic work is expended in delaminating thicker films. Further, the practical work of adhesion also increases with increasing annealing temperature, indicating stronger bonding at the interface. In the limit that the film thickness tends to zero, the plastic energy dissipation in the film tends to zero. As a result, the extrapolation to zero thickness yields the true work of adhesion for that system.