A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects
A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects
复制标题
多芯片直接安装的 512 MEMS 镜面阵列模块，采用密封封装，用于大型光学交叉连接
DOI：
10.1088/1464-4258/8/7/s08
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
I. Sawaki
中科院分区：
文献类型：
--
作者：
J. Mi;H. Soneda;H. Okuda;O. Tsuboi;N. Kouma;Y. Mizuno;S. Ueda;I. Sawaki
A 512 MEMS mirror array module with a hermetically sealed package for large optical cross-connects is constructed by using newly developed multi-chip direct mounting (MCDM) technology and is demonstrated to enable a plusmn5 degree rotation of the two-axis stationary operation under a drive voltage of 160 V, while having a high resonance frequency of 2 kHz
