High strength and high electrical conductivity CuMg alloy prepared by cryorolling
High strength and high electrical conductivity CuMg alloy prepared by cryorolling
复制标题
低温轧制制备高强高导铜镁合金
DOI：
10.1016/s1003-6326(19)64968-x
复制
发表时间：
2019-03-01
影响因子：
4.5
通讯作者：
Zheng, Yu-feng
中科院分区：
文献类型：
--
作者：
Tong, Yun-xiang;Li, Si-yuan;Zheng, Yu-feng
The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu-0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conductivity measurement. The results show that for the cryorolled sample, the grain size is decreased by 41% compared with the sample processed at room temperature. With increasing thickness reduction, the microhardness of the alloy continuously increases and the electrical conductivity decreases. For the sample with 90% thickness reduction rolled at cryogenic temperature, the tensile strength and the electrical conductivity are 726 MPa and 74.5% IACS, respectively. The improved tensile strength can be mainly attributed to the grain boundaries strengthening and dislocation strengthening.
