Influences of Ta passivation layers on the fatigue behavior of thin Cu films
Influences of Ta passivation layers on the fatigue behavior of thin Cu films
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DOI：
10.1016/j.msea.2014.05.024
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发表时间：
2014-07
期刊：
影响因子：
6.4
通讯作者：
Dong Wang;P. Gruber;C. Volkert;O. Kraft
中科院分区：
文献类型：
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作者：
Dong Wang;P. Gruber;C. Volkert;O. Kraft
采用循环拉伸试验研究了100 nm和1.0 μm厚Cu膜与10 nm Ta钝化层的疲劳行为。结果表明，Ta覆盖层通过抑制挤压形成而影响疲劳损伤，从而显著提高了1.0 µm厚Cu膜的疲劳寿命，但不改变100 nm厚Cu膜的疲劳寿命，其中裂纹形成是主要损伤机制。
Fatigue behavior of 100 nm and 1.0 µm thick Cu films with 10 nm Ta passivation layers has been studied using cyclic tensile testing. The results show that Ta capping-layer has influences on fatigue damage by suppression of extrusion formation and, thereby, improved the fatigue life dramatically in the 1.0 µm thick Cu film, but does not change the fatigue life of 100 nm thick Cu film for which crack formation is the dominant damage mechanism.