Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets
Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets
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DOI：
10.1109/tcpmt.2011.2169064
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发表时间：
2011-10
期刊：
影响因子：
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通讯作者：
D. Kam;Duixian Liu;Arun Natarajan;Scott K. Reynolds;Brian A. Floyd
中科院分区：
文献类型：
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作者：
D. Kam;Duixian Liu;Arun Natarajan;Scott K. Reynolds;Brian A. Floyd
演示了具有嵌入式 60 GHz 天线并与 60 GHz 相控阵发射器或接收器芯片完全集成的多层有机封装。该封装包括 16 个相控阵天线、一个用于容纳倒装芯片连接的射频芯片的开放腔以及在 DC-66 GHz 下运行的互连件。 28毫米28毫米球栅阵列封装采用印刷电路板工艺制造，并采用液晶聚合物和玻璃增强层压板的组合，可实现出色的60 GHz互连和天线性能。每个天线在 56 至 66 GHz 范围内测得的回波损耗和增益分别为 和 。最后，封装的发射器和接收器芯片组（每个芯片组均配有散热器）使用 16 正交幅度调制单载波和正交频分复用方案，展示了波束控制、非视距链路，数据速率高达 5.3 Gb/s。
A multilayer organic package with embedded 60-GHz antennas and fully integrated with a 60-GHz phased-array transmitter or receiver chip is demonstrated. The package includes sixteen phased-array antennas, an open cavity for housing the flip-chip attached RF chip, and interconnects operating at DC-66 GHz. The 28 mm 28 mm ball grid array package is manufactured using printed circuit board processes and uses a combination of liquid-crystal polymer and glass-reinforced laminates, allowing excellent 60-GHz interconnect and antenna performance. The measured return loss and gain of each antenna from 56 to 66 GHz are and , respectively. Finally, the packaged transmitter and receiver chipsets, each working with a heat sink, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s using 16-quadrature amplitude modulation single-carrier and orthogonal frequency division multiplexing schemes.