Laser induced activation of circuit lines and via-holes on AlN for electroless metal plating
Laser induced activation of circuit lines and via-holes on AlN for electroless metal plating
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DOI：
10.1016/j.apsusc.2011.02.085
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发表时间：
2011-05
期刊：
影响因子：
1.9
通讯作者：
K. Yung;Cong Chen;Chung-pang Lee
中科院分区：
文献类型：
--
作者：
K. Yung;Cong Chen;Chung-pang Lee
研究了激光诱导氮化铝化学镀铜表面微细线条和微孔的活化。与传统工艺不同的是，该方法是一种添加式无传感器工艺，工艺步骤少，可靠性高。紫外线、可见光和红外线激光用于活化氮化铝表面。叙述了激活质量与激光波长、能量密度、重复频率和重复次数的关系。首次观察到并报道了用这种方法在氮化铝中进行的与深度有关的微孔激活和金属化。
Laser induced activation of fine lines and micro via-holes on aluminium nitride for electroless copper plating is studied. Differing from traditional techniques, this method is demonstrated as an additive and precursorless process, which requires fewer processing steps with good reliability. Ultraviolet, visible and infrared lasers are applied to activate aluminium nitride surfaces. The relations between the quality of activation and laser wavelength, energy density, repetition rate and repetition are described. Depth-dependent activation and metallization of micro via-holes in aluminium nitride using this method are observed and reported for the first time.