High-throughput scanning electrochemical microscopy brushing of strongly tilted and curved surfaces
High-throughput scanning electrochemical microscopy brushing of strongly tilted and curved surfaces
复制标题
DOI：
10.1016/j.electacta.2013.03.101
复制
发表时间：
2013-11
影响因子：
6.6
通讯作者：
A. Lesch;Dmitry Momotenko;F. Cortés-Salazar;Folkert Roelfs;H. Girault;G. Wittstock
中科院分区：
文献类型：
--
作者：
A. Lesch;Dmitry Momotenko;F. Cortés-Salazar;Folkert Roelfs;H. Girault;G. Wittstock
通过用碳微电极的软线性阵列刷擦强倾斜（倾斜角≤4°）和弯曲基底（曲率直径≥9 cm）的高通量扫描电化学显微镜（SECM）的可行性被证明。这种由薄聚合物层制成的探头在接触状态下工作，以跟踪高度非常规的SECM样品的形貌，同时保持几乎恒定的工作距离。样品的强烈斜率变化导致定位系统的轴与微电极阵列的滑动方向之间的轻微不对准。可以预测和校正所得到的位置偏移，以产生样本表面上的空间关系的正确表示。此外，还开发了一种定制的保持器系统，该系统非常适合于精确控制软探针的倾斜角度和与衬底平面的对准，以在不到2 h的时间内对1.2 cm 2弯曲金属针进行高通量SECM成像。
The feasibility of high-throughput scanning electrochemical microscopy (SECM) of strongly tilted (tilt angles ≤4°) and curved substrates (diameter of curvature ≥9 cm) is demonstrated by brushing them with a soft linear array of carbon microelectrodes. This probe made of thin polymeric layers operates in contact regime to follow the topography of highly unconventional SECM samples while keeping an almost constant working distance. Strong slope variations of the sample lead to a slight misalignment between the axes of the positioning system and the sliding direction of the microelectrode arrays. The resulting positional offsets can be predicted and corrected to yield a correct representation of the spatial relation on the surface of the sample. Moreover, a custom-made holder system ideally suited for precise control of the soft probe inclination angle and alignment with the substrate plane was also developed to perform high-throughput SECM imaging of a 1.2 cm2curved metallic pin within less than 2 h.