Numerical analysis of dynamic debonding under 2D in-plane and 3D loading
Numerical analysis of dynamic debonding under 2D in-plane and 3D loading
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DOI：
10.1023/a:1007535703095
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发表时间：
1998-01-01
影响因子：
2.5
通讯作者：
Geubelle, PH
中科院分区：
文献类型：
--
作者：
Breitenfeld, MS;Geubelle, PH
我们提出了一个专门为二维和三维动态脱粘问题开发的数值方案。该方法，被称为频谱方案，允许一个精确的建模的静态和/或自发扩展的界面裂纹的任意形状，并进行任意组合的时间和空间相关的加载条件。它是基于一个频谱表示的弹性动力学之间存在的位移分量之间的关系，沿沿着界面平面和相应的动态应力。引入了一个通用的基于应力的内聚破坏模型来模拟界面的自发渐进破坏。数值方案还允许引入广泛的接触关系来模拟断裂面之间可能的相互作用。简单的二维问题被用来调查所提出的计划的精度和稳定性。然后，谱方法被用于各种二维和三维界面断裂问题，特别强调的问题的极限速度为一个自发扩展的脱粘裂纹在摩擦接触的存在。
We present a numerical scheme specially developed for 2D and 3D dynamic debonding problems. The method, referred to as spectral scheme, allows for a precise modeling of stationary and/or spontaneously expanding interfacial cracks of arbitrary shapes and subjected to an arbitrary combination of time- and space-dependent loading conditions. It is based on a spectral representation of the elastodynamic relations existing between the displacement components along the interface plane and the corresponding dynamic stresses. A general stress-based cohesive failure model is introduced to model the spontaneous progressive failure of the interface. The numerical scheme also allows for the introduction of a wide range of contact relations to model the possible interactions between the fracture surfaces. Simple 2D problems are used to investigate the accuracy and stability of the proposed scheme. Then, the spectral method is used in various 2D and 3D interfacial fracture problems, with special emphasis on the issue of the limiting speed for a spontaneously propagating debonding crack in the presence of frictional contact.