Effects of roughness on the wettability of high temperature wetting system
Effects of roughness on the wettability of high temperature wetting system
复制标题
粗糙度对高温润湿体系润湿性的影响
DOI：
10.1016/j.surfcoat.2015.12.092
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发表时间：
2016-02
期刊：
影响因子：
--
通讯作者：
Qu Xuanhui
中科院分区：
文献类型：
--
作者：
Chang lingling;zhang Lin;He Xinbo;Qu Xuanhui
采用座滴法研究了高温下基底粗糙度对非反应性润湿体系和复合形成润湿体系润湿性的影响。选择了AgCu共晶合金/Cu和AgCuTi/Al_2O_3润湿体系。结果发现，基板粗糙度有很大的影响，这两个润湿系统。对于非反应性润湿体系，当熔体进入粗糙表面的微V形槽时，存在一个额外的毛细驱动力，导致最终接触角（θf）减小，从而改善润湿性。对于形成金属/陶瓷反应润湿体系的化合物，在粗糙表面上的润湿表现出缓慢的铺展动力学和较短的铺展时间，并且由于克服了粗糙表面的粗糙度所引起的能垒，铺展的阻滞力增加，导致θf增加。因此，粗糙的基底对形成反应性润湿体系的化合物的润湿性具有负面影响。
The effects of substrate roughness on the wettability of non-reactive wetting and compound forming wetting systems were investigated by the sessile drop technique at high temperature. The AgCu eutectic alloy/copper and the AgCuTi/alumina wetting systems were selected. It is found that the substrate roughness has a great effect on both wetting systems. For the non-reactive wetting system, an additional capillary driving force exists when melt flows into the micro v-grooves of the rough surface, leading to a decrease in final contact angle (θf) and consequently a better wettability. For the compound forming metal/ceramic reactive wetting system, wetting on a rough surface exhibits a slow spreading kinetics and a short period of spreading time, and the retarding force of spreading increases because of overcoming the energy barriers due to asperities of the rough surface, resulting in an increase inθf. Thus, a rough substrate has negative effect on the wettability of the compound forming reactive wetting system.
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影响因子：
9.4
作者：
O. Kozlova;M. Braccini;R. Voytovych;N. Eustathopoulos;P. Martinetti;M. Devismes
通讯作者：
O. Kozlova;M. Braccini;R. Voytovych;N. Eustathopoulos;P. Martinetti;M. Devismes
影响因子：
6
作者：
P. Protsenko;A. Terlain;V. Traskine;N. Eustathopoulos
通讯作者：
P. Protsenko;A. Terlain;V. Traskine;N. Eustathopoulos
影响因子：
2.4
作者：
T. Soddemann;B. Duenweg;K. Kremer
通讯作者：
T. Soddemann;B. Duenweg;K. Kremer
DOI：
10.1016/s0927-7757(98)00778-x
发表时间：
1999-01-15
影响因子：
5.2
作者：
Apel-Paz, M;Marmur, A
通讯作者：
Marmur, A
影响因子：
9.4
作者：
Voué, M;De Coninck, J
通讯作者：
De Coninck, J