Experimental and Theoretical Analysis on Enhanced Flat Miniature Heat Pipes with Axial Capillary Grooves and Screen Meshes

Experimental and Theoretical Analysis on Enhanced Flat Miniature Heat Pipes with Axial Capillary Grooves and Screen Meshes
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轴向毛细管槽和筛网增强型扁平微型热管的实验与理论分析

DOI:
10.1109/theta.2007.363404
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发表时间:
2007
期刊:
2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application
影响因子:
--
通讯作者:
M.C. Zaghdoudi
M.C. Zaghdoudi
中科院分区:
--
文献类型:
--
作者:
S. Maalej;M.C. Zaghdoudi

文献摘要

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结合实验和分析研究实现,以验证平板微型热管(FMHP)的概念,用于冷却高功率耗散的电子元件,并确定构建阵列的微型通道作为一个集成的热管的一部分的潜在优势。采用由筛网和微通道组成的混合毛细管系统来制备FMHP。在实验研究中,不同的FMHP原型制造和测试。对于不同的测试配置,筛网的数量保持相同;但是使用不同的网格尺寸。通过比较热管热阻与具有与测试热管相同尺寸的铜板的热传导热阻获得的热传递改进被证明用于不同的原型。传热增强取决于输入热通量率、筛网孔隙率和FMHP相对于重力的取向。在分析研究中,建立了具有混合毛细管结构的MHP模型。分析结果与实验结果的比较表明,在预测最大毛细极限和FMHP热阻方面具有良好的一致性
Combined experimental and analytical studies are realized in order to verify the flat mini heat pipe (FMHP) concept for cooling high power dissipation electronic components, and determine the potential advantages of constructing arrays of mini channels as an integrated part of a heat pipe. A mixed capillary system, which is composed of screen meshes and mini-channels, is used in order to manufacture the FMHP. In the experimental study, different FMHP prototypes are manufactured and tested. The number of screen meshes is kept the same for the different tested configurations; however different meshing sizes are used. The heat transfer improvement, obtained by comparing the heat pipe thermal resistance to the heat conduction thermal resistance of a copper plate having the same dimensions as the tested heat pipes, is demonstrated for the different prototypes. The heat transfer enhancement depends on the input heat flux rate, the screen mesh porosity, and the FMHP orientation in respect to gravity. In the analytical study, a model of MHP with mixed capillary structure is developed. The comparison between the analytical and experimental results shows a good agreement in predicting both the maximum capillary limit and the FMHP thermal resistance