Investigations on glass-to-mold sticking in the hot forming process
Investigations on glass-to-mold sticking in the hot forming process
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DOI：
10.1016/j.jnoncrysol.2007.02.095
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发表时间：
2008-02
影响因子：
3.5
通讯作者：
D. Rieser;G. Spiess;P. Manns
中科院分区：
文献类型：
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作者：
D. Rieser;G. Spiess;P. Manns
采用一种新的测试方法，研究了玻璃容器制造等玻璃热熔成型工艺中各种模具材料和涂层的粘附行为。在冲压过程中，模具材料试样与热粘性玻璃采空区频繁接触，预先设定了明确的非等温冲压参数，以模拟工业工作条件。在本研究中使用了三种不同的玻璃成分：钠钙硅酸盐玻璃、铅晶体玻璃和硼硅酸盐玻璃。测试的模具材料和涂层的粘着特性由两个量来描述，即“下”和“上”粘着温度，这是特定于每种模具材料和非等温压制过程中的玻璃类型的。发现未涂层模具材料的“较低”粘着温度单调地依赖于大块模具材料的热渗透系数（热渗透系数）。与未涂覆的材料相比，应用于各种基材模具材料的所有涂层材料都可以降低“较低”的粘附温度。发现大多数涂层材料也降低了“上”粘着温度。
The sticking behavior of various mold materials and coatings for hot glass melt forming processes, like, e.g. glass container manufacturing, was investigated using a new testing procedure. The mold material specimens under test were subjected to frequent contact with hot viscous glass gobs in a pressing process with presetting well defined non-isothermal pressing parameters to simulate industrial working conditions. Three different glass compositions were used in this investigation, soda-lime silicate glass, lead crystal glass, and borosilicate glass. The sticking characteristics of the tested mold materials and coatings were described by two quantities, a ‘lower’ and an ‘upper’ sticking temperature, which are specific for each mold material and type of glass in the non-isothermal pressing process. The ‘lower’ sticking temperatures of uncoated mold materials were found to depend monotonically on the thermal effusivity (heat penetration coefficient) of the bulk mold materials. All of the coating materials applied to various substrate mold materials were found to reduce the ‘lower’ sticking temperature as compared to the uncoated materials. Most of the coating materials were found to reduce also the ‘upper’ sticking temperature.