Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing
Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing
复制标题
DOI：
10.1149/1945-7111/abcbb2
复制
发表时间：
2020-12-01
影响因子：
3.9
通讯作者：
Guo, Dongming
中科院分区：
文献类型：
--
作者：
Wang, Ke;Yan, Ying;Guo, Dongming
超平坦和超光滑的铜（Cu）表面被广泛用作光学反射镜、散热器和功能材料生长的衬底。传统的抛光方法依赖于磨料颗粒，容易产生磨料嵌埋和表面划痕等机械缺陷。本研究提出了一种结合喷射电化学加工（jet - ecm）和电化学抛光（ECP）的无应力加工新工艺，以制备超平整、超光滑的铜表面。通过对材料去除率的精确控制和喷管轨迹的规划，可以在射流- ecm工艺中有效地获得超平坦表面。采用与射流电解加工相同的电解液，可以进一步提高工件表面粗糙度。结果表明，表明Cu表面形状误差的表面峰谷比（PV）值从4.4 μ m减小到1.7 μ m，表面粗糙度Sa从70.3 nm减小到13.5 nm。采用相同的电解液和设备，将射流电解加工与电解加工相结合，可以显著提高表面平整度和粗糙度。该研究提高了无应力加工方法的加工精度，对进一步了解电化学去除机理具有重要意义。
Ultra-flat and ultra-smooth copper (Cu) surfaces are widely used as optical mirrors, heat sinks, and substrates for functional material growth. Traditional polishing methods that rely on abrasive particles are easy to induce mechanical defects such as abrasives embedding and scratches on surfaces. A new stress-free machining process is proposed in this research to fabricate an ultra-flat and ultra-smooth Cu surface by combining jet electrochemical machining (Jet-ECM) and electrochemical polishing (ECP). With the accurate manipulating of material removal rate (MRR) and planning of nozzle trajectory, an ultra-flat surface can be obtained efficiently in the Jet-ECM process. The surface roughness of the workpiece can be further improved by ECP with the same electrolyte used in the Jet-ECM process. The results show that the surface peak-to-valley (PV) value which indicated the surface form error of the Cu surface was reduced from 4.4 mu m to 1.7 mu m and the surface roughness Sa was reduced from 70.3 nm to 13.5 nm. The combination of Jet-ECM and ECP which share the same electrolyte and apparatus can improve the surface flatness and roughness significantly. This study improves the machining accuracy of stress-free machining methods and has great implications for the further understanding of the electrochemical removal mechanism.