Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication
Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication
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DOI：
10.1109/esscirc55480.2022.9911320
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发表时间：
2022-09
期刊：
影响因子：
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通讯作者：
K. Sengupta;S. Venkatesh;H. Saeidi;Xuyang Lu
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文献类型：
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作者：
K. Sengupta;S. Venkatesh;H. Saeidi;Xuyang Lu
5G毫米波（mmWave）网络的初步部署表明，虽然它们可以在低时延下通过空间复用维持Gb/s无线链路，但由于其定向波束的性质，它们也极易受到阻塞、信道中断和衰落的影响。稳健的毫米波覆盖要求基站的高度密集化，这是极其昂贵和复杂的。可重构智能表面（RISs）已经成为一种通过创建更有利的传输特性来允许无线电传播环境的智能重构的技术。这种无源表面由可重构的散射或天线元件组成，具有可扩展性和广泛的可部署性。这些阵列在微波界传统上被称为反射/发射阵列，当与硅IC结合在一起时，它们的新化身现在可以允许频率扩展到毫米波/太赫兹，快速可编程性，可扩展性，按需放大（用于有源表面）和传感。在这里，我们提出的情况下，这样的表面，设计挑战，最近的国家的最先进的工作，以及它们对未来的无线网络的影响。
The initial deployment of 5G millimeter-Wave (mmWave) networks have shown that while they can sustain Gb/s wireless links with spatial multiplexing at low latencies, they are also highly susceptible to blockages, channel disruptions, and fading due to the nature of their directive beams. Robust mmWave coverage requires high densification of base stations that is prohibitively expensive and complex. Reconfigurable intelligent surfaces (RISs) have emerged as a technology to allow smart reconfiguration of the radio propagation environment by creating more favorable transmission characteristics. Constituted as an array of reconfigurable scattering or antenna elements, such passive surface (with near zero DC power consumption) are scalable and widely deployable. Traditionally referred to as reflect/transmit arrays in the microwave community, these arrays, when combined with silicon ICs in their new avatar, can now allow frequency scaling into the mmWave/THz, rapid programmability, scalability, amplification on-demand (for active surfaces), and sensing. Here, we present the case for such surfaces, design challenges, recent state-of-the-art work, and their impact for future wireless networks.