3D Printing High‐Resolution Conductive Elastomeric Structures with a Solid Particle‐Free Emulsion Ink
3D Printing High‐Resolution Conductive Elastomeric Structures with a Solid Particle‐Free Emulsion Ink
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DOI：
10.1002/adem.202100902
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发表时间：
2021-08
影响因子：
3.6
通讯作者：
Chen Wang;G. Chaudhary;R. Ewoldt;R. Nuzzo
中科院分区：
文献类型：
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作者：
Chen Wang;G. Chaudhary;R. Ewoldt;R. Nuzzo
在微尺度和中尺度上制造复杂结构是先进传感器和软电子设计的一个关键方面。然而，软光刻方法提供了制造这种结构的重要方法，增材制造领域的进展（例如，3D打印）提供了具有更多材料复杂性的制造方法。然而，印刷材料的流变复杂性通常决定了印刷的局限性。特别是，合成打印材料所涉及的挑战，可以在较小的尺度（<100 μm）下保持形状，但仍然是导电的，限制了3D打印在软微电子领域的许多应用。在此，提出了一种使用新型无颗粒导电乳液油墨的以印刷为中心的方法。该方法分离了导电单体（吡咯）的印刷和聚合，并提供了一种用于印刷细丝的新型油墨，该油墨迄今为止不可能实现3D特征尺寸并构建具有高形状保持性的结构。评价油墨的可印刷性，并评估后处理特性。使用乳液油墨印刷多方向应变传感器以说明软电子器件中的示例性应用。
Fabricating complex structures on micro‐ and mesoscales is a critical aspect in the design of advanced sensors and soft electronics. However, soft lithographic methods offer an important approach to fabricating such structures, the progress in the field of additive manufacturing (e.g., 3D printing) offers methods of fabrication with much more material complexity. The rheological complexity of the printing material, however, often dictates the limitations of printing. In particular, the challenges involved in synthesizing printing materials that can enable shape retention at smaller scales (<100 μm), yet be conductive, limits many applications of 3D printing to soft microelectronics. Herein, a printing‐centered approach using a novel particle‐free conductive emulsion ink is presented. This approach separates the printing and polymerization of a conductive monomer (pyrrole) and renders a novel ink that is used to print filaments with heretofore impossible to realize 3D feature dimensions and build structures with high shape retention. The printability of the ink is evaluated, and post‐treatment properties assessed. Multidirectional strain sensors are printed using the emulsion ink to illustrate an exemplary application in soft electronics.