Copper/Parylene Core/Shell Nanowire Surface Fastener Used for Room-Temperature Electrical Bonding
Copper/Parylene Core/Shell Nanowire Surface Fastener Used for Room-Temperature Electrical Bonding
复制标题
DOI：
10.1021/la402475f
复制
发表时间：
2013-11-12
期刊：
影响因子：
3.9
通讯作者：
Hosoi, Atsushi
中科院分区：
文献类型：
--
作者：
Wang, Peng;Ju, Yang;Hosoi, Atsushi
电子组装中的传统键合技术依赖于高温工艺，例如回流焊接或粘合剂固化，这会导致键合界面处出现不期望的热偏移和残余应力。因此，迫切需要在室温下将具有良好机械和电气性能的电子元件附着在电路板上。本文制备了一种由铜/聚对二甲苯核/壳纳米线（NW）阵列组成的室温电表面紧固件，并利用范德华（VDW）力将核/壳纳米线互连。有趣的是，当聚对二甲苯C薄膜的厚度缩小到纳米级时，由于介电击穿而变得导电。我们的电气表面紧固件具有高宏观粘合强度（类似于 25 N/cm(2)）和低电阻（类似于 4.22 x 10(-2) Omega.cm(2)）。同时，提出了一种基于纳米线之间的VDW力的新理论模型来解释核/壳结构的粘附机制。
The traditional bonding technology in electronic assembly relies on high-temperature processes, such as reflow soldering or curing of adhesives, which result in undesired thermal excursions and residual stress at the bonding interface. Therefore, there is an urgent need to attach electronic components on the circuit board with good mechanical and electrical properties at room temperature. In this paper, a room-temperature electrical surface fastener consisting of copper/parylene core/shell nanowire (NW) arrays were prepared, and van der Waals (VDW) forces were utilized to interconnect the core/shell NWs. Interestingly, the Parylene C film becomes conductive due to dielectric breakdown when the thickness of it is miniaturized to nanoscale. Our electrical surface fastener exhibits high macroscopic adhesion strength (similar to 25 N/cm(2)) and low electrical resistance (similar to 4.22 x 10(-2) Omega.cm(2)). Meanwhile, a new theoretical model based on VDW forces between the NWs is proposed to explain the adhesion mechanism of the core/shell structure.