Laser Chemical Processing (LCP)—A versatile tool for microstructuring applications
Laser Chemical Processing (LCP)—A versatile tool for microstructuring applications
复制标题
激光化学加工 (LCP) — 用于微结构应用的多功能工具
DOI：
--
复制
发表时间：
2008
期刊：
影响因子：
--
通讯作者：
S. Glunz
中科院分区：
文献类型：
--
作者：
D. Kray;A. Fell;S. Hopman;K. Mayer;G. Willeke;S. Glunz
激光化学加工 (LCP) 是一种适用于多种应用的新型微结构方法。通过化学液体射流和激光束的结合，可以引发热化学和光化学反应。由于可以自由选择载液和激光源的化学成分，因此可以为多种应用设计高效的工艺。我们提供了一些硅微结构的例子，重点是蚀刻、磷的选择性掺杂以及蚀刻和掺杂的组合。
Laser Chemical Processing (LCP) is presented as a novel microstructuring method for multiple applications. Via the combination of a chemical liquid jet and a laser beam, thermochemical and photochemical reactions can be initiated. Due to the free choice of the chemistry for the carrier liquid and the laser source, efficient processes can be devised for a large variety of applications. We present some examples for the microstructuring of silicon with the focus on etching, selective doping of phosphorous and the combination of etching and doping.