Influence of Additive-Free process on the Microstructure of Very Narrow Cu Wires in the Lower Region of a Trench
Influence of Additive-Free process on the Microstructure of Very Narrow Cu Wires in the Lower Region of a Trench
复制标题
无添加剂工艺对沟槽下部极细铜线微观结构的影响
DOI:
--
复制
发表时间:
2013
期刊:
影响因子:
--
通讯作者:
Y.Ke,T.Namekawa,K.Tamahashi and J.Onuki
中科院分区:
文献类型:
--
作者:
冨士田誠之;田中良典;高橋和;野田進;保井晃;A. Takeuchi;Y.Ke,T.Namekawa,K.Tamahashi and J.Onuki